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Qualcomm lands autonomous driving projects with Toyota and FAW’s Hongqi

The new collaborations highlight the cost-effectiveness of Qualcomm’s chips as a key differentiator amid escalating competition from Nvidia and Horizon Robotics, among others.

3 mins read
  • After finding success on home ground, Microview is now introducing its high-precision semiconductor packaging equipment to the American and European markets.

    Features

    Microview secures funds to export high-precision die-bonding equipment to the US and Europe

    2 mins read

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