Syenta, an Australian
semiconductor startup, has raised AUD 8.8 million in a pre-Series A funding round led by Investible, with participation from Blackbird Ventures, Jelix Ventures, Brindabella Capital, OIF Ventures, Salus Ventures, Wollemi Capital Group, SGInnovate, and In-Q-Tel. The company is developing a patented process to build high-speed interconnects between chiplets to overcome memory bandwidth bottlenecks and boost performance.